Example: Warpage Countermeasures for Connectors in Injection Molding
By collaborating with 3D TIMON, we automatically adjust the thickness of the solid element model, thereby suppressing warping deformation.
Here is an example of minimizing warpage by changing the thickness of solid elements. The analysis was conducted using the "Basis Vector Method," which modifies the shape by moving the nodes of the finite element model without using CAD. Several patterns (basis vectors) of the desired shape were prepared from the initial model and combined. As a result of the optimization, the sum of squares of warpage improved by 33% to 4.9480e-004 compared to the initial shape, and the maximum warpage (mm) improved by 12% to 3.8607e-002. [Case Overview] ■ Optimization Conditions - Design Variables: Thickness A, B - Sampling: Initially LHS 20 points, Approximate optimal solution + 10 recommended points - Approximate Model: CRBF (Convolutional RBF) ■ Analysis: Basis Vector Method *For more details, please refer to the PDF document or feel free to contact us.
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